Semix SOD SS8002

SOD Products: TR6003 | Services | Upgrades

SS8002

There's a lot of talk about low k these days, but at SEMIX, we've been putting low k solutions into action for quite awhile. The fact is, our spin-on solutions are delivering low k results today and are already prepared for tomorrow's requirements.

Production ready, the Vortex SS series spin coating system is designed for processing all advanced inorganic and organic low k materials. The SEMIX Vortex offers low k extendibility down to dielectric constants of less than 2.0, via our exclusive Immersion chamber, which offers instant tunable dielectric control for porous material processing.

Innovative options such as Low O2 control, high-temperature bake plates and rotary cup technology (RCT) culminate in a better approach to spin-coating.

The benefits of RCT will be especially important for 300mm development, as it significantly eliminates deposition control problems associated with larger substrates. Rotary cup technology also provides outstanding performance in terms of planarization, uniformity, gap fill and "local" step coverage.

Features	Benefits
Low κ SOD coater system Complete process flexibility 6 – 8 inch capability Multi-chemical compatibility CE compliant Semi S2-93A compliant	Over 100 wafers per hour Improved particle control Uniformity <1% Batch uniformity <1% Up-time 95% Flexibility and extendibility

Spin-On Material Systems

Our dedication to spin-on technology is unsurpassed. As the pioneer in this industry, SEMIX has been able to develop the most reliable and cost-effective coaters in the world—industry-leading in price/performance. Our focus is to provide superior products and service, increasing your production yields while reducing your cost of ownership.

Rotary Cup
	Optional rotary cup technology significantly increases planarity and “local” step coverage over conventional “open cup” designs. A multi-patented chemical handling system assures stringent particulate and uniformity control. The cup design contributes to a greater rinse and flush capability, minimizing cup maintenance. Multiple dispense arms eliminate cross contamination between dispense lines.
Robots
	A centralized multi-functional robot with dedicated Hot and Cold end effectors smoothly and efficiently transfers wafers from station to station, ensuring consistent temperature control during wafer handling. With the addition of a load robot, we have also increased processing capacity.
Bake Plate		Cool Plate
	Stacked bake plates soft-bake the wafers from 50°–350°C via contact or proximity bake.		A liquid-cooled cool plate stabilizes the wafers’ temperature prior to processing.

Specifications

Click to enlarge image

Cassette stations (4)
Robots (2)
Chemical coating station (1 to 2)

Stacked baked plates (3 to 12)
Cool plate (1 to 2)
360° equipment enclosure

Hardware Options	Integrated Furnace Dual cup processing 450°C high temperature bake plate Low O content bake plate Temperature and humidity control unit Ultra-violet chamber Special processing chambers
General	Wafer size: 6-8” (150-200mm) Multi-process flexibility Multi-coat capability Multi-chemical compatibility Color TFT touch screen control pane Cassette: same slot correspondence SECS I/II, GEM compliant-optional
Coat	Patented process cup designs Multi-patented dispense system (2 arms) Programmable edge bead rinse (dynamic) Programmable backside rinse Programmable forced cup exhaust High accuracy AC spindle motor
Cool / Bake	Cool plate: 19°-27°C (1°C increments) Bake plate: 50°-350°C (1°C increments) High temperature bake plate: 50°-450°C-optional Proximity or contact bake plates
Transfer	6 axis multi-functional robot with quad-end effectors 4 axis “edge hold” robot with single end effector

*Specifications are subject to change without notice.

For more information please contact:

Service@semix.com
Tel: (510)659-8800	Fax:(510)659-8444